Magnetron having enhanced target cooling configuration
US11024490B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2018 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Feb 20, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3455
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of magnetron assemblies and processing systems incorporating same are provided herein. In some embodiments, a magnetron assembly includes a rotatable magnet assembly coupled to a bottom of the body and having a plurality of magnets spaced apart from each other; and an encapsulating body disposed in a space between the plurality of magnets. In some embodiments, the magnetron assembly further includes a body extending along a central axis of the magnetron assembly and having a coolant feedthrough channel to provide a coolant to an area beneath the body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.