Device arrangement structure assembly having adhesive tape layer
US11024552B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2020 |
| Grant date | Jun 1, 2021 |
| Priority date | — |
| Expiry date | Jan 10, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/036
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly includes a wafer having a top wafer surface and a wafer circumference. The assembly further includes a device arrangement structure. The device arrangement structure includes a first surface having a perimeter, the perimeter being encircled by the wafer circumference in a plan view; and an array of devices, each device of the array of devices having an electrical contact on the first surface. The assembly further includes an adhesive element configured to affix the device arrangement structure in a stationary position relative to the wafer, wherein the adhesive element includes a tape layer having an adhesive surface attached to the top surface of the device arrangement structure and attached to a surface of the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.