Mingo Liu
17Patents
4h-index
34Co-inventors
60Inventor score
Filing activity: Jan 17, 2002 → Jun 11, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10269586B2 | Package structure and methods of forming same | Electricity | 38 | Active |
| US8970023B2 | Package structure and methods of forming same | Electricity | 25 | Active |
| US8012785B2 | Method of fabricating an integrated CMOS-MEMS device | Performing Operations; Transporting | 13 | Active |
| US8648468B2 | Hermetic wafer level packaging | Electricity | 6 | Active |
| US9275598B2 | DAC architecture for LCD source driver | Electricity | 3 | Active |
| US8338906B2 | Schottky device | Electricity | 2 | Active |
| US9628102B2 | Integrated circuits, liquid crystal display (LCD) drivers, and systems | Electricity | 1 | Active |
| US6797528B2 | Micro probing tip made by micro machine method | Physics | 1 | Expired |
| US10535572B2 | Device arrangement structure assembly and test method | Electricity | 1 | Active |
| US8188898B2 | Integrated circuits, liquid crystal display (LCD) drivers, and systems | Electricity | 1 | Active |
| US8981979B2 | Integrated circuits, liquid crystal display (LCD) drivers, and systems | Electricity | 0 | Active |
| US9236273B2 | UV protection for lightly doped regions | Electricity | 0 | Active |
| US11735485B2 | Integrated circuit devices with well regions and methods for forming the same | Electricity | 0 | Active |
| US10269658B2 | Integrated circuit devices with well regions and methods for forming the same | Electricity | 0 | Active |
| US11024552B2 | Device arrangement structure assembly having adhesive tape layer | Electricity | 0 | Active |
| US9337168B2 | Hermetic wafer level packaging | Electricity | 0 | Active |
| US11043431B2 | Integrated circuit devices with well regions | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.