Physical vapor deposition (PVD) electrostatic chuck with improved thermal coupling for temperature sensitive processes
US11031273B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2018 |
| Grant date | Jun 8, 2021 |
| Priority date | — |
| Expiry date | May 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02N13/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of an electrostatic chuck are provided herein. In some embodiments an electrostatic chuck includes an electrode, a dielectric body having a disk shape and covering the electrode, the dielectric body including a central region and a peripheral region, and the dielectric body including a lower surface having a central opening and an upper surface having a first opening in the central region and a plurality of second openings in the peripheral region, wherein the upper surface includes a plurality of protrusions and a diameter of each of the plurality of second openings is greater than 25.0 mils, and gas distribution channels that extend from the lower surface to the upper surface to define a plenum within the dielectric body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.