Patent · US Active

Acidic aqueous composition for electrolytic copper plating

US11035051B2 · kind B2 · utility

1Cited by

9References

13Claims

0Family size

Assignee

Atotech Deutschland GmbH & Co. KG · DE

Inventors

Kun SI · Berlin, DE
Ralf Schmidt · Berlin, DE
Onas Bolton · Dearborn, US
Josef Gaida · Berlin, DE
Frank Von Horsten · Berlin, DE
Dirk Rohde · Berlin, DE
Himendra Jha · Berlin, DE
Jens Palm · Berlin, DE
Olivier Mann · Berlin, DE
Angela Llavona-Serrano · Berlin, DE

Key dates

Filing date	Aug 10, 2017
Grant date	Jun 15, 2021
Priority date	—
Expiry date	Dec 28, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D7/123
WIPO fieldOrganic fine chemistry
WIPO sectorChemistry

Abstract

The present invention relates to an acidic aqueous composition (plating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.