Chip bonding device and bonding method thereof
US11037900B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 2017 |
| Grant date | Jun 15, 2021 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/7598
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip bonding apparatus and method are disclosed. The chip bonding apparatus includes: at least one separation module for separating chips; at least one bonding module for bonding the chips a substrate; a transportation device for transporting the chips between the separation module and the bonding module, the transportation device including one or more guide tracks and one or more transportation carriers for retaining the chips, each of the guide tracks is provided thereon with at least one of the transportation carriers; and a control device for individually controlling the separation module, the bonding module and the transportation device. The chip bonding apparatus and method allows pickup, transportation and chip-to-substrate bonding of chips in batches with increased chip bonding yield and improved chip bonding accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.