Hai Xia
13Patents
1h-index
23Co-inventors
50Inventor score
Filing activity: Feb 13, 2012 → May 24, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10651717B2 | Six-degree-of-freedom linear motor | Electricity | 1 | Active |
| US10223183B2 | Rapid fault detection method and device | Physics | 1 | Active |
| US10658327B1 | Chip bonding apparatus and bonding method | Electricity | 1 | Active |
| US10748800B2 | Chip bonding apparatus and method | Electricity | 1 | Active |
| US8920031B2 | Split type aerostatic bearing | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US10770320B2 | Universal chip batch-bonding apparatus and method | Electricity | 0 | Active |
| US10824477B2 | Network function virtualization service container creation | Electricity | 0 | Active |
| US10763235B2 | Batch bonding apparatus and bonding method | Electricity | 0 | Active |
| US10768960B2 | Method for affinity binding of interrupt of virtual network interface card, and computer device | Physics | 0 | Active |
| US11037900B2 | Chip bonding device and bonding method thereof | Electricity | 0 | Active |
| US9575032B2 | Method of analyzing at least two inhibitors simultaneously in a plating bath | Physics | 0 | Active |
| US11081380B2 | Chip bonding device | Electricity | 0 | Active |
| US12423126B2 | Pod deployment method and apparatus | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.