Semiconductor module

US11040872B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Claus Waechter · Sinzing, DE
• Edward Fuergut · Nuremberg, DE
• Bernd Goller · Otterfing, DE
• Michael Ledutke · Ribnitz-Damgarten, DE
• Dominic Maier · Pleystein, DE

Key dates

• Filing date: Oct 8, 2019
• Grant date: Jun 22, 2021
• Expiry date: Oct 8, 2039

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/0792
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The method comprises fabricating a semiconductor panel comprising a plurality of semiconductor devices, fabricating a cap panel comprising a plurality of caps, bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices, and singulating the bonded panels into a plurality of semiconductor modules.