Claus Waechter
9Patents
2h-index
25Co-inventors
43Inventor score
Filing activity: Feb 17, 2016 → Oct 21, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11195787B2 | Semiconductor device including an antenna | Electricity | 4 | Active |
| US10549985B2 | Semiconductor package with a through port for sensor applications | Performing Operations; Transporting | 3 | Active |
| US10899604B2 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Performing Operations; Transporting | 1 | Active |
| US10435292B2 | Method for producing a semiconductor module | Performing Operations; Transporting | 1 | Active |
| US11145563B2 | Semiconductor devices having cutouts in an encapsulation material and associated production methods | Electricity | 0 | Active |
| US11251146B2 | Semiconductor devices having a non-galvanic connection | Electricity | 0 | Active |
| US12368111B2 | Semiconductor apparatuses with radio-frequency line elements, and associated manufacturing methods | Electricity | 0 | Active |
| US11040872B2 | Semiconductor module | Performing Operations; Transporting | 0 | Active |
| US11505450B2 | Integration of stress decoupling and particle filter on a single wafer or in combination with a waferlevel package | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.