Fluidized alignment of a semiconductor die to a test probe
US11041879B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 6, 2019 |
| Grant date | Jun 22, 2021 |
| Priority date | — |
| Expiry date | Dec 19, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2867
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor die is aligned to a test probe by placing the semiconductor die onto a flat upper surface of a test stage with solder balls of the die facing upward, fluidizing motion of the die with reference to the test stage by pulsing gas between the die and the upper surface of the test stage, and coarse aligning the die with reference to the test stage by moving the die until adjacent edges of the die contact corner guides that are disposed on the test stage. Further, the method includes raising the test stage toward the test probe until an alignment feature of the test probe engages a first solder ball of the die, and fine aligning the die with reference to the test probe by continuing to raise the test stage until a second solder ball of the die fits into a test cup of the test probe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.