Patent · US Active

Structure for radio frequency applications

US11043756B2 · kind B2 · utility

1Cited by
3References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 29, 2018
Grant dateJun 22, 2021
Priority date—
Expiry dateJan 29, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D30/6758
  • WIPO fieldTelecommunications
  • WIPO sectorElectrical engineering

Abstract

A structure for radiofrequency applications includes a high-resistivity support substrate having a front face defining a main plane, a charge-trapping layer disposed on the front face of the support substrate, a first dielectric layer disposed on the charge-trapping layer, an active layer disposed on the first dielectric layer, at least one buried electrode disposed above or in the charge-trapping layer. The buried electrode comprises a conductive layer and a second dielectric layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.