Patent · US Active

Method for processing a monocrystalline substrate and micromechanical structure

US11046577B2 · kind B2 · utility

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8Claims

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Assignee

Infineon Technologies AG · DE

Inventors

Andre Brockmeier · Villach, AT
Roland Rupp · Achern, DE
Francisco Javier Santos Rodriguez · Villach, AT

Key dates

Filing date	Feb 19, 2020
Grant date	Jun 29, 2021
Priority date	—
Expiry date	Feb 19, 2040

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2201/0192
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

In various embodiments, a method of processing a monocrystalline substrate is provided. The method may include severing the substrate along a main processing side into at least two monocrystalline substrate segments, and forming a micromechanical structure comprising at least one monocrystalline substrate segment of the at least two substrate segments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.