Andre Brockmeier
32Patents
3h-index
43Co-inventors
59Inventor score
Filing activity: Mar 8, 2012 → Mar 9, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8841768B2 | Chip package and a method for manufacturing a chip package | Electricity | 5 | Active |
| US11211459B2 | Semiconductor device and method of manufacturing a semiconductor device | Electricity | 4 | Active |
| US9570542B2 | Semiconductor device including a vertical edge termination structure and method of manufacturing | Electricity | 4 | Active |
| US9219020B2 | Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices | Electricity | 3 | Active |
| US9981844B2 | Method of manufacturing semiconductor device with glass pieces | Emerging Cross-Sectional Technologies | 2 | Active |
| US10615040B2 | Superjunction structure in a power semiconductor device | Electricity | 2 | Active |
| US9385075B2 | Glass carrier with embedded semiconductor device and metal layers on the top surface | Electricity | 2 | Active |
| US10112861B2 | Method of manufacturing a plurality of glass members, a method of manufacturing an optical member, and array of glass members in a glass substrate | Chemistry; Metallurgy | 1 | Active |
| US9601376B2 | Semiconductor device and method of manufacturing a semiconductor device having a glass piece and a single-crystalline semiconductor portion | Electricity | 1 | Active |
| US9503823B2 | Capacitive microphone with insulated conductive plate | Electricity | 1 | Active |
| US9847235B2 | Semiconductor device with plated lead frame, and method for manufacturing thereof | Electricity | 1 | Active |
| US10276656B2 | Method of manufacturing semiconductor devices by using epitaxy and semiconductor devices with a lateral structure | Electricity | 1 | Active |
| US11148943B2 | Glass piece and methods of manufacturing glass pieces and semiconductor devices with glass pieces | Emerging Cross-Sectional Technologies | 0 | Active |
| US10242840B2 | Energy filter for processing a power semiconductor device | Electricity | 0 | Active |
| US10766766B2 | Method for processing a layer structure and microelectromechanical component | Performing Operations; Transporting | 0 | Active |
| US11787686B2 | Method for processing a layer structure and microelectromechanical component | Performing Operations; Transporting | 0 | Active |
| US11180362B2 | Method for processing a layer structure and microelectromechanical component | Performing Operations; Transporting | 0 | Active |
| US12415719B2 | MEMS sensor with particle filter and method for producing it | Electricity | 0 | Active |
| US11502190B2 | Vertical power semiconductor device, semiconductor wafer or bare-die arrangement, carrier, and method of manufacturing a vertical power semiconductor device | Electricity | 0 | Active |
| US11046577B2 | Method for processing a monocrystalline substrate and micromechanical structure | Performing Operations; Transporting | 0 | Active |
| US9439017B2 | Method for manufacturing a plurality of microphone structures, microphone and mobile device | Emerging Cross-Sectional Technologies | 0 | Active |
| US10049912B2 | Method of manufacturing a semiconductor device having a vertical edge termination structure | Electricity | 0 | Active |
| US11939216B2 | Method with stealth dicing process for fabricating MEMS semiconductor chips | Performing Operations; Transporting | 0 | Active |
| US12060266B2 | Method with mechanical dicing process for producing MEMS components | Performing Operations; Transporting | 0 | Active |
| US11393784B2 | Semiconductor package devices and method for forming semiconductor package devices | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.