Protective yttria coating for semiconductor equipment parts
US11047035B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2019 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Feb 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.