Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component
US11048167B2 · kind B2 · utility
0Cited by
6References
9Claims
0Family size
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Key dates
| Filing date | Jan 22, 2016 |
| Grant date | Jun 29, 2021 |
| Priority date | — |
| Expiry date | Mar 10, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G71/04
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.