Semiconductor substrate supports with embedded RF shield

US11049755B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• David Benjaminson · Campbell, US
• Michael H. Grace · Terry, US
• Soonam Park · Sunnyvale, US
• Dmitry Lubomirsky · Cupertino, US
• Jaeyong Cho · San Jose, US
• Nikolai Kalnin · Belmont, US
• Don Channa Kaluarachchi · San Jose, US

Key dates

• Filing date: Sep 14, 2018
• Grant date: Jun 29, 2021
• Expiry date: Apr 18, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67167
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Exemplary support assemblies may include a top puck defining a substrate support surface, where the top puck is also characterized by a height. The assemblies may include a stem coupled with the top puck on a second surface of the top puck opposite the substrate support surface. The assemblies may include an RF electrode embedded within the top puck proximate the substrate support surface. The assemblies may include a heater embedded within the top puck. The assemblies may also include a ground shield embedded within the top puck. The ground shield may be characterized by an inner region extending radially through the top puck. The ground shield may further be characterized by an outer region extending perpendicular to the inner region.