Soonam Park
77Patents
24h-index
78Co-inventors
87Inventor score
Filing activity: Nov 28, 2006 → Mar 14, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7989365B2 | Remote plasma source seasoning | Emerging Cross-Sectional Technologies | 599 | Active |
| US9132436B2 | Chemical control features in wafer process equipment | Electricity | 197 | Active |
| US9117855B2 | Polarity control for remote plasma | Electricity | 183 | Active |
| US8969212B2 | Dry-etch selectivity | Electricity | 182 | Active |
| US9299537B2 | Radial waveguide systems and methods for post-match control of microwaves | Electricity | 157 | Active |
| US9299538B2 | Radial waveguide systems and methods for post-match control of microwaves | Electricity | 153 | Active |
| US9299582B2 | Selective etch for metal-containing materials | Electricity | 153 | Active |
| US9355922B2 | Systems and methods for internal surface conditioning in plasma processing equipment | Electricity | 147 | Active |
| US9384997B2 | Dry-etch selectivity | Electricity | 145 | Active |
| US9472417B2 | Plasma-free metal etch | Electricity | 136 | Active |
| US9373517B2 | Semiconductor processing with DC assisted RF power for improved control | Electricity | 135 | Active |
| US9564296B2 | Radial waveguide systems and methods for post-match control of microwaves | Electricity | 129 | Active |
| US9659753B2 | Grooved insulator to reduce leakage current | Electricity | 123 | Active |
| US9728437B2 | High temperature chuck for plasma processing systems | Electricity | 117 | Active |
| US9711366B2 | Selective etch for metal-containing materials | Electricity | 115 | Active |
| US9773648B2 | Dual discharge modes operation for remote plasma | Electricity | 113 | Active |
| US9837249B2 | Radial waveguide systems and methods for post-match control of microwaves | Electricity | 111 | Active |
| US8894767B2 | Flow control features of CVD chambers | Emerging Cross-Sectional Technologies | 105 | Active |
| US9978564B2 | Chemical control features in wafer process equipment | Electricity | 105 | Active |
| US9947549B1 | Cobalt-containing material removal | Electricity | 103 | Active |
| US9966240B2 | Systems and methods for internal surface conditioning assessment in plasma processing equipment | Electricity | 100 | Active |
| US10032606B2 | Semiconductor processing with DC assisted RF power for improved control | Electricity | 94 | Active |
| US9593421B2 | Particle generation suppressor by DC bias modulation | Electricity | 55 | Active |
| US10354843B2 | Chemical control features in wafer process equipment | Electricity | 38 | Active |
| US9892888B2 | Particle generation suppresor by DC bias modulation | Electricity | 23 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.