Redistribution metal and under bump metal interconnect structures and method

US11049829B2 · kind B2 · utility

Assignee

• Avago Technologies International Sales Pte. Limited · SG

Inventors

• Sam Ziqun Zhao · Irvine, US
• Liming Tsau · Irvine, US
• Edward Law · Ladera Ranch, US
• Andy Brotman · Irvine, US

Key dates

• Filing date: Dec 2, 2019
• Grant date: Jun 29, 2021
• Expiry date: Dec 2, 2039

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit die includes a metal layer, a first passivation layer disposed above the metal layer, an aluminum containing redistribution layer disposed above the first passivation layer, an under bump metallization layer, and a redistribution layer plug. The redistribution layer plug is coupled to the metal layer and disposed in a via in the first passivation layer. The under bump metallization layer is coupled to the aluminum containing redistribution layer above the first passivation layer at a distance from the redistribution layer plug.