Apparatus for electrochemically processing semiconductor substrates
US11066754B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Jan 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/2885
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing a front face of a semiconductor wafer is provided. The apparatus includes a main chamber, at least one loading port connected to the main chamber for introducing the wafer to the main chamber, at least one stack of wafer processing modules, and a transfer mechanism for transferring the wafer between the loading port and the processing modules. The at least one stack of wafer processing modules includes three or more substantially vertically stacked wafer processing modules, wherein adjacent wafer processing modules in the stack have a vertical separation of less than 50 cm, and each processing module is configured to process the wafer when disposed substantially horizontally therein with the front face of the wafer facing upwards, and at least one wafer processing module is an electrochemical wafer processing module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.