Method of material deposition
US11069523B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 21, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | May 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02214
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for material deposition onto a sample to form a protective layer composed of at least two materials that have been formulated and arranged according to the material properties of the sample.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.