Electronic package
US11069661B1 · kind B1 · utility
0Cited by
4References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2020 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Jun 23, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic package is formed by arranging two encapsulating portions of different materials between a plurality of electronic components stacked to each other to adjust a stress distribution of the electronic package, so that the degree of warpage of the electronic package can be optimally controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.