Slurry distribution device for chemical mechanical polishing

US11077536B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Yen-Chu Yang · Santa Clara, US
• Stephen Jew · San Jose, US
• Jianshe Tang · San Jose, US
• Haosheng Wu · San Jose, US
• Shou-Sung Chang · Mountain View, US
• Paul D. Butterfield · San Jose, US
• Alexander John Fisher · Santa Clara, US
• Bum Jick Kim · Irvine, US

Key dates

• Filing date: Jun 19, 2017
• Grant date: Aug 3, 2021
• Expiry date: Oct 4, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/6708
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.