Bum Jick Kim
9Patents
2h-index
14Co-inventors
40Inventor score
Filing activity: Oct 24, 2014 → Aug 26, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10350728B2 | System and process for in situ byproduct removal and platen cooling during CMP | Electricity | 7 | Active |
| US10967483B2 | Slurry distribution device for chemical mechanical polishing | Electricity | 2 | Active |
| US11077536B2 | Slurry distribution device for chemical mechanical polishing | Electricity | 2 | Active |
| US9452506B2 | Vacuum cleaning systems for polishing pads, and related methods | Performing Operations; Transporting | 2 | Active |
| US9687960B2 | Polishing pad cleaning systems employing fluid outlets oriented to direct fluid under spray bodies and towards inlet ports, and related methods | Performing Operations; Transporting | 1 | Active |
| US12076877B2 | Polishing platens and polishing platen manufacturing methods | Performing Operations; Transporting | 0 | Active |
| US11806835B2 | Slurry distribution device for chemical mechanical polishing | Electricity | 0 | Active |
| US11389925B2 | Offset head-spindle for chemical mechanical polishing | Performing Operations; Transporting | 0 | Active |
| US11986926B2 | Slurry distribution device for chemical mechanical polishing | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.