Azimuthal critical dimension non-uniformity for double patterning process
US11078570B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2018 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Nov 6, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for adjusting a position of a showerhead in a processing chamber includes arranging a substrate that includes a plurality of mandrels on a substrate support in the processing chamber and adjusting a position of the showerhead relative to the substrate support. Adjusting the position of the showerhead includes adjusting the showerhead to a tilted position based on data indicating a correlation between the position of the showerhead and azimuthal non-uniformities associated with etching the substrate. The method further includes, with the showerhead in the tilted position as adjusted based on the data, performing a trim step to etch the plurality of mandrels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.