Inventor · Beaverton, OR, US

Pulkit Agarwal

30Patents
5h-index
54Co-inventors
64Inventor score

Filing activity: May 30, 2014 → Mar 17, 2021

Most-cited inventions

PatentTitleAreaCited byStatus
US9997371B1 Atomic layer etch methods and hardware for patterning applications Electricity 36 Active
US10269559B2 Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer Electricity 25 Active
US10494715B2 Atomic layer clean for removal of photoresist patterning scum Electricity 13 Active
US9425076B2 Substrate transfer robot end effector Electricity 9 Active
US9536329B2 Method and apparatus for performing sentiment analysis based on user reactions to displayable content Physics 6 Active
US10658172B2 Dielectric gapfill of high aspect ratio features utilizing a sacrificial etch cap layer Electricity 5 Active
US10655224B2 Conical wafer centering and holding device for semiconductor processing Electricity 4 Active
US11236422B2 Multi zone substrate support for ALD film property correction and tunability Electricity 3 Active
US10579371B2 Recommendations for custom software upgrade by cognitive technologies Physics 2 Active
US12040181B2 Modulated atomic layer deposition Electricity 2 Active
US10431451B2 Methods and apparatuses for increasing reactor processing batch size Electricity 1 Active
US11520828B2 Methods for representing and storing data in a graph data structure using artificial intelligence Physics 1 Active
US9947578B2 Methods for forming low-resistance contacts through integrated process flow systems Electricity 1 Active
US10431489B2 Substrate support apparatus having reduced substrate particle generation Electricity 0 Active
US11651963B2 Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film Electricity 0 Active
US11078570B2 Azimuthal critical dimension non-uniformity for double patterning process Chemistry; Metallurgy 0 Active
US11913113B2 Method and apparatus for modulating film uniformity Electricity 0 Active
US9925639B2 Cleaning of chamber components with solid carbon dioxide particles Performing Operations; Transporting 0 Active
US11542599B2 Method and apparatus for providing station to station uniformity Electricity 0 Active
US10727143B2 Method for controlling core critical dimension variation using flash trim sequence Electricity 0 Active
US10847352B2 Compensating chamber and process effects to improve critical dimension variation for trim process Electricity 0 Active
US10978302B2 Method of improving deposition induced CD imbalance using spatially selective ashing of carbon based film Electricity 0 Active
US11322416B2 Controller for controlling core critical dimension variation using flash trim sequence Electricity 0 Active
US12322619B2 Dynamic process control in semiconductor manufacturing Physics 0 Active
US12057300B2 Apparatus for cleaning plasma chambers Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.