Chip bonding device

US11081380B2 · kind B2 · utility

Assignee

• SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO., LTD · CN

Inventors

• Feibiao Chen · Shanghai, CN
• Hai Xia · Nanhu, CN
• Yuebin Zhu · Shanghai, CN
• Hailin Cheng · Shanghai, CN
• Xiaoyu Jiang · Shandong, CN
• Lili Zhao · Boston, US
• Donghao ZHANG · Kunshan, CN

Key dates

• Filing date: Feb 27, 2018
• Grant date: Aug 3, 2021
• Expiry date: Jun 6, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67092
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A chip bonding apparatus includes a chip separation unit, a chip alignment unit, a chip bonding unit and a bonding robotic arm unit. The bonding robotic arm unit includes a first bonding robotic arm unit and a second bonding robotic arm unit. The first bonding robotic arm unit includes a first motion stage, a first driver configured to drive the first motion stage and at least one first bonding robotic arm arranged on the first motion stage. The first bonding robotic arm is configured to suck up a chip from the chip separation unit and deliver it to the chip alignment unit. The second bonding robotic arm unit includes a second motion stage, a second driver configured to drive the second motion stage and at least one second bonding robotic arm arranged on the second motion stage.