Method for producing an integral join and automatic placement machine
US11081464B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2016 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Aug 21, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15787
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A powder carrier, to which a powder layer containing a metal powder is applied, is provided by an automatic powder carrier feed. A first joining partner is pressed onto the powder layer located on the powder carrier so as to bond a powder layer portion to the first joining partner. The first joining partner is raised from the powder carrier together with the powder layer portion bonded to the first joining partner, and the powder layer portion bonded to the first joining partner is arranged between the first and second joining partners. A sintered join is produced between the first and second joining partners by pressing the first and second joining partners against one another such that the powder layer portion makes contact with both the first and second joining partners. The powder layer portion is sintered as the joining partners are being pressed against one another.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.