Nicolas Heuck
4Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Aug 29, 2012 → May 27, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8835299B2 | Pre-sintered semiconductor die structure | Electricity | 3 | Active |
| US9659793B2 | Method for producing a material-bonding connection between a semiconductor chip and a metal layer | Electricity | 2 | Active |
| US10615138B2 | Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods | Electricity | 0 | Active |
| US11081464B2 | Method for producing an integral join and automatic placement machine | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.