Wafer susceptor apparatus with thermal insulation and method for manufacturing the same
US11088012B2 · kind B2 · utility
0Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68757
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plate for supporting wafer has a top for carrying a wafer and a bottom coupled to a pedestal. The plate includes multiple heating units embedded within the plate and at least one set of grooves formed between the top and the bottom of the plate at a radial location between two of neighboring heating units to thereby enhance heat insulation among the heating units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.