Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy

US11091849B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Josef Gaida · Berlin, DE
• Jan SPERLING · Berlin, DE
• Mauro CASTELLANI · Berlin, DE
• Grigory VAZHENIN · Berlin, DE
• Stefanie ACKERMANN · Berlin, DE
• Heiko Brunner · Berlin, DE
• Dirk Rohde · Berlin, DE

Key dates

• Filing date: Sep 13, 2018
• Grant date: Aug 17, 2021
• Expiry date: Sep 13, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/0786
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An aqueous bath for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy, the bath comprising