Jan SPERLING
4Patents
0h-index
11Co-inventors
28Inventor score
Filing activity: Oct 4, 2016 → Sep 13, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10753007B2 | Process for indium or indium alloy deposition and article | Chemistry; Metallurgy | 0 | Active |
| US11032914B2 | Method of forming a solderable solder deposit on a contact pad | Electricity | 0 | Active |
| US11091849B2 | Bath and method for filling a vertical interconnect access or trench of a work piece with nickel or a nickel alloy | Electricity | 0 | Active |
| US10793962B2 | Aqueous indium or indium alloy plating bath and process for deposition of indium or an indium alloy | Chemistry; Metallurgy | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.