Semiconductor wafer measurement method and system
US11094057B2 · kind B2 · utility
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Key dates
| Filing date | Aug 3, 2020 |
| Grant date | Aug 17, 2021 |
| Priority date | — |
| Expiry date | Aug 3, 2040 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method includes capturing a raw image from a semiconductor wafer, using graphic data system (GDS) information corresponding to the wafer to assign a measurement box in the raw image, performing a distance measurement on a feature of the raw image in the measurement box, and performing a manufacturing activity based on the distance measurement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.