Pre-heat processes for millisecond anneal system
US11101142B2 · kind B2 · utility
2Cited by
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Key dates
| Filing date | Jun 5, 2020 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Jun 5, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Preheat processes for a millisecond anneal system are provided. In one example implementation, a heat treatment process can include receiving a substrate on a wafer support in a processing chamber of a millisecond anneal system; heating the substrate to an intermediate temperature; and heating the substrate using a millisecond heating flash. Prior to heating the substrate to the intermediate temperature, the process can include heating the substrate to a pre-bake temperature for a soak period.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.