Substrate processing method and substrate processing apparatus
US11101147B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2018 |
| Grant date | Aug 24, 2021 |
| Priority date | — |
| Expiry date | Nov 29, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A substrate processing method includes a first processing liquid supplying step of supplying a first processing liquid to an upper surface of the substrate, a holding layer forming step of solidifying or curing the first processing liquid to form a particle holding layer on the upper surface of the substrate, a holding layer removing step of peeling and removing the particle holding layer from the upper surface of the substrate, a liquid film forming step of forming, after removing the particle holding layer from the substrate, a liquid film of the second processing liquid, a solidifying step of cooling the liquid film to a temperature not more than a melting point of the sublimable substance to make the liquid film solidify on the substrate and form a solid film, and a sublimating step of sublimating and thereby removing the solid film from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.