Chip on film package and display device including the same
US11107743B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 4, 2019 |
| Grant date | Aug 31, 2021 |
| Priority date | — |
| Expiry date | Nov 19, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10128
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip on film package includes; a flexible base film having a first surface and a second surface opposite to each other, and having a chip mounting region on the first surface; a plurality of wirings extending in a first direction toward the chip mounting region; a semiconductor chip mounted in the chip mounting region on the first surface of the base film and electrically connected to the wirings; a pair of first heat dissipation members on the first surface of the base film and spaced apart from the semiconductor chip, and extending in a second direction perpendicular to the first direction; and a second heat dissipation member on the first surface of the base film and covering the semiconductor chip and the pair of first heat dissipation members.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.