Substrate chucking and dechucking methods
US11114326B2 · kind B2 · utility
2Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | May 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32091
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.