Semiconductor device and method for fabricating the same
US11114448B2 · kind B2 · utility
0Cited by
1References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2019 |
| Grant date | Sep 7, 2021 |
| Priority date | — |
| Expiry date | Aug 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B20/25
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present application discloses a semiconductor device and a method for fabricating the semiconductor device. The semiconductor device includes a substrate having a first region and a second region, a first semiconductor element positioned in the first region of the substrate, a second semiconductor element positioned in the first region of the substrate, a bridge conductive unit electrically connected the first semiconductor element and the second semiconductor element, and a programmable unit positioned in the second region and electrically connected to the bridge conductive unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.