Method for arranging two substrates
US11121091B2 · kind B2 · utility
1Cited by
6References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 20, 2017 |
| Grant date | Sep 14, 2021 |
| Priority date | — |
| Expiry date | Mar 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0015
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and device for the alignment of substrates that are to be bonded. The method includes detecting and storing positions of alignment mark pairs located on surfaces of the substrates, and aligning the substrates with respect to each other in accordance with the detected positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.