Systems, devices, and methods for combined wafer and photomask inspection
US11125677B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2019 |
| Grant date | Sep 21, 2021 |
| Priority date | — |
| Expiry date | Apr 8, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68785
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems, devices, and methods for combined wafer and photomask inspection are provided. In some embodiments, chucks are provided, the chucks comprising: a removable insert, wherein the removable insert is configured to support a wafer so that an examination surface of the wafer lies within a focal range when the chuck is in a first configuration, wherein the removable insert is inserted into the chuck in the first configuration; and a first structure forming a recess that has a depth sufficient to support a photomask so that an examination surface of the photomask lies within the focal range when the chuck is in a second configuration, wherein the removable insert is not inserted into the chuck in the second configuration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.