Resist underlayer film forming composition which contains compound having glycoluril skeleton as additive
US11131928B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2017 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Sep 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/40
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention provides a resist underlayer film forming composition which contains a compound having a glycoluril skeleton and which prevents collapse of a resist pattern formed on a substrate in a lithography process during semiconductor production; a resist underlayer film which uses this composition; and a method for producing a semiconductor device. The compound is of formula (1-1), wherein each of R1-R4 represents a C2-C10 alkyl group wherein a hydrogen atom is substituted by at least one substituent selected from the group consisting of a hydroxy group, a thiol group, a carboxyl group, C1-C5 alkoxyethyl groups, C1-C5 alkylsulfanyl groups and organic groups containing an ester bond, or a C2-C10 alkenyl group; the R1-R4 moieties may be the same as or different from each other; and each of R5 and R6 represents a hydrogen atom or a group selected from among C1-C10 alkyl groups and a phenyl group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.