Patent · US Active

Method for die-level unique authentication and serialization of semiconductor devices using electrical and optical marking

US11133206B2 · kind B2 · utility

0Cited by

5References

11Claims

0Family size

Assignee

TOKYO ELECTRON LIMITED · JP

Inventors

H. Jim Fulford · Austin, US
Anthony R. Schepis · Averill Park, US
Anton J. deVilliers · Boise, US

Key dates

Filing date	Jul 31, 2019
Grant date	Sep 28, 2021
Priority date	—
Expiry date	Jul 31, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/5444
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A method for marking a semiconductor substrate at the die level for providing unique authentication and serialization includes projecting a first pattern of actinic radiation onto a layer of photoresist on the substrate using mask-based photolithography, the first pattern defining semiconductor device structures and projecting a second pattern of actinic radiation onto the layer of photoresist using direct-write projection, the second pattern defining a unique wiring structure having a unique electrical signature.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.