Sensor package structure and sensing module thereof
US11133348B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2020 |
| Grant date | Sep 28, 2021 |
| Priority date | — |
| Expiry date | Jan 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/854
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A sensor package structure and a sensing module thereof are provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the sensor chip, a light-permeable layer arranged above the sensor chip through the light-curing layer, and a shielding layer disposed on a surface of the light-permeable layer. The light-curing layer has an inner lateral side and an outer lateral side opposite to the inner lateral side, and the inner lateral side is separated from the outer lateral side by a first distance. In a transverse direction parallel to a top surface of the sensor chip, the outer lateral side is separated from an outer lateral edge by a second distance which is within a range of ½ to ⅓ of the first distance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.