Patent · US Active

Printed wiring-board islands for connecting chip packages and methods of assembling same

US11134573B2 · kind B2 · utility

1Cited by

1References

23Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Georg Seidemann · Landshut, DE
Sonja Koller · Regensburg, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Sep 29, 2017
Grant date	Sep 28, 2021
Priority date	—
Expiry date	Sep 29, 2037

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A printed wiring-board island relieves added complexity to a printed circuit board. The printed wiring-board island creates an island form factor in the printed circuit board. Coupling of a semiconductive device package to the printed wiring-board island includes a ball-grid array. The ball-grid array can at least partially penetrate the printed wiring-board island.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.