Stretchable interconnects for flexible electronic surfaces
US11139089B2 · kind B2 · utility
0Cited by
5References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2020 |
| Grant date | Oct 5, 2021 |
| Priority date | — |
| Expiry date | May 29, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.