Heat transfer for power modules
US11145571B2 · kind B2 · utility
1Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2019 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Oct 6, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06589
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one general aspect, an apparatus can include a substrate, a semiconductor die coupled with a first surface of the substrate, and a metal layer disposed on a second surface of the substrate. The second surface can be opposite the first surface. The apparatus can also include a plurality of metal fins coupled with the metal layer, and a metal ring coupled with the metal layer. The metal ring can surround the plurality of metal fins.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.