Patent · US Active

Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus

US11145577B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Sonja Koller · Regensburg, DE
Georg Seidemann · Landshut, DE
Reinhard Mahnkopf · Oberhaching, DE
Bernd Waidhas · Nittendorf, DE

Key dates

Filing date	Dec 29, 2016
Grant date	Oct 12, 2021
Priority date	—
Expiry date	Dec 29, 2036

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/73253
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A system-in-package apparatus includes a square wave lead frame that provides a recess for a first semiconductive device as well as a feature for a second device. The system-in-package apparatus includes a printed wiling board that is wrapped onto the lead frame after a manner to enclose the first semiconductive device into the recess.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.