High density die package configuration on system boards
US11145632B2 · kind B2 · utility
1Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2017 |
| Grant date | Oct 12, 2021 |
| Priority date | — |
| Expiry date | Sep 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A high density die package configuration is shown for use on system boards. In one example, an apparatus includes a system board, a first package mounted to the system board, a second package mounted to the system board, and an interface package mounted between the first and the second package and coupled directly to the first package and to the second package through the respective first and second packages.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.