Cleaning composition, cleaning apparatus, and method of fabricating semiconductor device using the same
US11149234B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jan 17, 2019 |
| Grant date | Oct 19, 2021 |
| Priority date | — |
| Expiry date | May 23, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A cleaning composition, a cleaning apparatus, and a method of fabricating a semiconductor device, the cleaning composition including a surfactant; deionized water; and an organic compound, wherein the surfactant is included in the cleaning composition in a concentration of about 0.28 M to about 0.39 M or a mole fraction of about 0.01 to about 0.017, and wherein the organic compound is included in the cleaning composition in a concentration of about 7.1 M to about 7.5 M or a mole fraction of about 0.27 to about 0.35.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.