Compositions and methods for removing ceria particles from a surface
US11164738B2 · kind B2 · utility
0Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2018 |
| Grant date | Nov 2, 2021 |
| Priority date | — |
| Expiry date | Jan 18, 2038 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2201/54
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A removal composition and process for cleaning post-chemical mechanical polishing (CMP) contaminants and ceria particles from a microelectronic device having said particles and contaminants thereon. The composition achieves highly efficacious removal of the ceria particles and CMP contaminant material from the surface of the microelectronic device without compromising the low-k dielectric, silicon nitride, or tungsten-containing materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.