Patent · US Active

Method and device for plating a recess in a substrate

US11164748B2 · kind B2 · utility

1Cited by

1References

12Claims

0Family size

Assignee

SEMSYSCO GMBH · AT

Inventors

Franz Markut · St. Georgen, AT
Thomas Wirnsberger · Seeboden, AT
Oliver Knoll · Salzburg, AT
Andreas Gleissner · Radenthein, AT
Harald Okorn-Schmidt · Putnam Valley, US
Philipp Engesser · Villach, AT

Key dates

Filing date	Jan 24, 2019
Grant date	Nov 2, 2021
Priority date	—
Expiry date	Jan 24, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/76898
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

The invention relates to a method for plating a recess in a substrate, a device for plating a recess in a substrate and a system for plating a recess in a substrate comprising the device. The method for plating a recess in a substrate comprises the following steps:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.